The impact of the proportion of nanoparticles to the spherical microparticles of silver on the connection parameters LTJT

There are few EU directives restricting use of lead and other hazardous substances in electronics. That leads to ban Pb-Sn alloy from use, the consequence of which is a search for new ways of preparing joints. One of the discussed solutions is using silver particles in Low Temperature Joining Technique (LTJT). This technique allows to use different conducting pastes and lower their sintering temperatures with the use of pressure. The most popular material for the joining tests was silver. Due to its high melting temperature and high pressures needed for lowering the temperature, silver nanoparticles were considered and tested. The temperatures of sintering decreased to 300oC and the pressures went down from about 40 to less than 10 MPa. Due to unsatisfactory parameters of such joints, the authors prepared mixtures of spherical, submicron-sized silver particles with nanoparticles. Joints were tested for their electrical and shears strength parameters. In this article, the authors show the comparison of different variations of the mixtures with joints prepared only with nanoparticles.